TSMC DNA Summer Internship
The TSMC DNA summer internship brings students to Taiwan for project work with TSMC engineers, lectures and a shot at an advance offer. It is open to enrolled students from any major, across several TSMC sites in Taiwan.
Taiwan
On-siteNot stated
Pay not stated
Not stated
Summer cycleWho can apply
- Current students
TSMC says the DNA summer internship "provides a unique and exciting opportunity for you to gain overseas work experience, learn about the semiconductor industry, and expand your professional network", working alongside experts from different backgrounds. During the internship you are assigned projects based on your own expertise or the needs of the department you join.
The programme name maps to what it offers: Develop, a series of designed lectures; Navigate, hands on projects with TSMC experts; and Advance Offer, a chance to earn an early full time offer through strong performance. Tracks include research and development, semiconductor process R&D, design and technology platform, integrated interconnect and packaging, equipment, process integration, intelligent manufacturing, quality and reliability, materials, and information technology, with the IT track requiring a HackerRank test. TSMC states that students from all majors are welcome, that applicants must hold enrolled student status, and that incoming graduates of the following year are prioritised in screening; anyone already graduating is told to apply to full time roles instead. The listing read for this entry gave an interview period of December 2026 to March 2027, a summer programme period with a flexible onboarding date, and locations in Hsinchu, Tainan, Taichung, Zhunan, Longtan, Kaohsiung and Chiayi.
Verification
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- Application link checked
- Deadline not confirmed
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Last checked 23 days ago (22 Sept 2026)
Not checked in over 14 days. Confirm the details on the company’s own posting before you apply.
About the company
Semiconductor foundry that manufactures chips designed by other companies, using advanced process and packaging technology.
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